Wafer Bonding: Applications and Technology (Springer Series in Materials Science Book 75)
Produktdetails
| Artikelnummer | 233379559 | Erscheinungsdatum | 2026/06/27 | Listenpreis | €94.76 | Modellnummer | 233379559 | ||
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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. Read more
| ASIN | B000TDYE3W |
|---|---|
| XRay | Not Enabled |
| ISBN13 | 978-3662108277 |
| Edition | 2004th |
| Language | English |
| File size | 9.9 MB |
| Page Flip | Not Enabled |
| Publisher | Springer |
| Word Wise | Not Enabled |
| Print length | 499 pages |
| Accessibility | Learn more |
| Part of series | Springer Series in Materials Science |
| Publication date | March 9, 2013 |
| Enhanced typesetting | Not Enabled |
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