Sn63/Pb37 Tin Solder Paste, 183℃ Melting Point, 20-38µm Tin Paste For Electronic, Soldering Flux for PCB, IC, BGA, SMD Repair (5 Pack)

Solder Flux,NC-559-ASM No Clean Soldering Flux Paste,Lead Free Rosin Flux,10cc Tacky Soldering Flux,Soldering Liquid Flux for Electronics,For BGA,SMD,USB Socket Repairing With Pneumatic Dispenser with Plunger and Dispensing Tip

• Sn63/Pb37 Tin Solder Paste: Melting point of 183 degrees,Wetting, anti-dry, relatively long shelf life at room temperature. Unique high-quality solder paste,solid solder joints, no bubbles, no cracks, smooth, bright, full.
• High-Purity & Performance: High-end quality, a unique formula, perfect performance, easy to weld, solder joint is bright and full, no weld, false welding phenomenon.No Clean, Strong Viscosity, Bright Welding Point.
• Innovative Push-Rod Design: Experience precise solder paste application with our unique push-rod design, minimizing waste and ensuring a smoother soldering process. Sn63/Pb37 Tin Solder Paste Ideal for delicate IC, SMD, SMT, BGA, and home appliance repairs.
• Widely Applicable: The residue is colorless and transparent, does not affect the detection, is disposable, and has excellent cleaning performance. The use of efficient energy thixotropic agents,can show excellent and stable printing performance, improve the quality of welding.
• Versatile Use: Whether you’re soldering IC/BGA components, doing phone repairs, or working on home appliances, our soldering paste is suitable for a wide range of applications, including desoldering tasks.