INEX Chipset Gap Fill Heat Transfer Putty HP-01

■ Clay heat transfer putty. ■ Can be used between the chipset such as CPU, GPU, M.2 SSD, memory chip, etc. ■ The shape can be adjusted, so it is suitable for filling rough surfaces. ■Can be used with chipsets such as expansion cards, memory, motherboards, etc. ■ Since the shape is free-up, it is also compatible with M.2 SSDs of sizes such as 2230/2242/2260. ■ Can be freely shaped, so it can be used for a variety of purposes. ■Insulation/flame retardant properties. ■ Non-sticky, so it will not damage the surface of the item you want to cool. Note: There is no adhesive force, so please use the heatsink in an environment where it is fixed with pins, screws, or tape.

• Clay heat transfer putty. Suitable for filling rough surfaces
• Thermal conductivity: 6.0W/m / K
• Heat Resistance: 0.025 °C, in2/W, Operating Temperature: -4 to 330 °F (-20 to 150 °C)
• Insulation Breaking Voltage: >2.5kV/mm, Specific Gravity: 3.2g/cm3
• Color: Gray; Quantity: 5g; RoHS compliant (10 substances)