7" Digital Soldering Microscope with Remote for Electronics Repair, 1200X IPS Screen PCB Magnifier, 16M 1080P HDMI/USB Output, 2 Gooseneck Side Lights for SMD Microsoldering (MK7)
€24.00
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€24.00
Preis bei Onlinekauf
Kostenloser Versand
30 Tage kostenlose Rückgabe
Verkauft und versendet von agenciacoranto.com.ar
30 Tage kostenlose Rückgabe Details
Produktdetails
| Artikelnummer | 209849243 | Erscheinungsdatum | 2026/04/02 | Listenpreis | €24.00 | Modellnummer | 209849243 | ||
|---|---|---|---|---|---|---|---|---|---|
| Kategorie | |||||||||
- High-Clearance Stand for Soldering Irons: Unlike short stands that block tools, our adjustable height design provides ample working distance for soldering irons and tweezers. The 7-inch IPS Screen delivers lag-free 1080P feedback, allowing you to perform precision microsoldering on logic boards and inspect tiny SMD components (0201/0402 sizes) without hunching over
- Glare-Free PCB Inspection System: Circuit boards are highly reflective, making standard ring lights ineffective. Our dual Flexible Gooseneck Auxiliary Lamps allow you to adjust the lighting angle to eliminate hotspots on solder joints and read laser markings on IC chips clearly. Adjust brightness via the dedicated Light Wheel for optimal contrast
- Vibration-Free Remote Control Operation: Avoid image shaking during critical inspections. The included Remote Control lets you snap 16M photos, record videos, and zoom digitally without touching the microscope unit. This is crucial when documenting solder bridge defects or burnt traces for repair logs
- PC Live View for Fault Analysis: Connect via USB Type-C to use "PC Camera" mode for a larger view on Windows (via HiView/Camera) or Mac (via Photo Booth). Perfect for showing defects to customers, conducting team training, or measuring component dimensions using compatible software
- True-Color IPS Display: The 7-inch panel offers a wider viewing angle and accurate color reproduction compared to standard LCDs. This helps in identifying burnt components by color discoloration and differentiating between copper traces and solder mask layers effectively
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