2pcs 25x25x11mm Pure Copper Mini HeatSink Radiator for Chip MOS IC 3D Printer Electronic Cooling Cooler

Material:CopperProcessing method: Skiving finFinishing:Antioxidant treatment Size: 25x25x11mm Bottom Thickness: 3 mmCopper Fin thickness: 0.4mmPackage: 2 pcs/lotUsed for Electronic, CHIP,IC,MOS,3D printer,computer 's component heat dissipation, or anywhere you need a efficient heatsink.This is high qualityand effective heatsink that made pricise processing,smooth surface,no burr,we recommand you choose this .

• 1. Efficient heat dissipation with high thermal conductivity for rapid equipment cooling;
• 2. Lightweight design for easy installation;
• 3. Excellent energy-saving performance;
• 4. Aesthetic appearance with wear resistance;
• 5. Widely applied in: machinery, automotive, wind power generation, construction equipment, air compressors, railway locomotives, home appliances, and other industrial sectors.